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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1/20 datashee t tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 14 ? 001 sw fb agnd vin pgnd en comp BD86123AEFJ c1 c2 r2 r3 r1 c3 l 4.5v to 18v, 3a 1ch synchronous buck converter BD86123AEFJ description the BD86123AEFJ is synchronous buck converters. the device integrates power mosfets that provide a each maximums current output current continuous load current over a wide operating input voltage of 4.5v to 18v. current mode operation provi des fast transient response and easy phase compensation. the output power mosfets using p-type moseft (hi side) and n-type moseft (low side), then this device don?t need boot capacitor. the BD86123AEFJ is htsop-j8 standard packages. applications lcd tvs set top boxes dvd/blu-ray players/recorders broadband network and communication interface amusement, other features ? input voltage range: 4.5v to 18.0v ? reference voltage 0.8v 1% ? average output current: 3a(max.) ? switching frequency: 550khz(typ.) ? pch fet on resistance: 90m (typ.) ? nch fet on resistance: 50m (typ.) ? standby current: 1 a (typ.) ? operating temperature range: -40 to +85 ? cycle by cycle over current protection(ocp) ? thermal shutdown (tsd) ? under voltage lock out(uvlo) ? short circuit protection(scp) ? over voltage protection(ovp) ? fixed soft start 5msec package w(typ.) x d(typ.) x h(max.) htsop-j8 4.90mm x 6.00mm x 1.00mm typical application figure 2. pin configuration sw sw fb p g nd vin en agnd comp 7 8 6 5 3 4 2 1 (top view) figure 1. application circuit
datasheet d a t a s h e e t 2/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 block diagram vreg osc ibias uvlo tsd slop e softstart logic ocp scp s r vin sw pgnd fb agn d pwm err comp en ovp pin description no. symbol description 1 pgnd power ground pin. power ground return for switching circuit. 2 vin input voltage supply pin. 3 en enable input control. active high. 4 agnd analog ground pin. electrically needs to be connected to pgnd. 5 fb converter feedback input. connect to output voltage with feedback resistor divider. 6 comp error amplifier output, and input to t he output switch current comparator. external loop compensation pin. 7 sw switch node connection between high-side pch fet and low-side nch fet. 8 sw switch node connection between high-side pch fet and low-side nch fet. thermal pad back side thermal pad of the package. must be soldered to ac hieve appropriate dissipat ion. must be connected to agnd. figure 3. block diagram
datasheet d a t a s h e e t 3/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25 ) parameter symbol ratings unit condition input supply voltage v in 20 v sw terminal voltage v sw 20 v en terminal voltage v en 20 v power dissipation pd 3760* mw 70mm70mm, thickness 1.6mm, and 4 layer glass epoxy substrates operating temperature topr -40 +85 storage temperature ts t g - 5 5 +150 maximum junction temperature tjmax 150 fb, comp terminal voltage v lvpins 7 v * operating at higher than ta=25 , 30.08mw shall be reduced per 1 operating conditions parameter symbol ratings unit min. typ. max. input supply voltage v in 4.5 - 18.0 v output current i out - - 5.0 a output voltage range v range v in 0.08 * - v in 0.8 v * v in 0.08 R 0.8 [v]
datasheet d a t a s h e e t 4/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise noted ta=25 , v in =12v, v en = 3v) parameter symbol limits unit condition min. typ. max. v in supply current (operating) i q_active - 1.5 2.5 ma v fb = 0.75v, v en = 5v v in supply current (standby) i q_stby - 1.0 10.0 a v en = 0v reference voltage (vref) v fb 0.792 0.800 0.808 v fb-comp short (voltage follower) fb input bias current i fb - 0 2 a oscillation frequency f osc 500 550 600 khz high side fet on resistance r onh - 90 - m ? v in = 12v , i sw = -1a low side fet on resistance r onl - 50 - m ? v in = 12v , i sw = -1a sw leak current i lsw - 0 5 a v in = 18v , v sw = 18v switch current limit i limit 3.7 - - a min duty min_duty - - 8 % uvlo voltage v uvlo 3.8 4.1 4.4 v v in sweep up uvlo hysteresis v uvlohys - 0.3 - v en terminal h threshold voltage v enh 2.0 - - v en terminal l threshold voltage v enl - - 0.8 v soft start time t ss 3.0 5.0 7.0 msec v fb :fb terminal voltage, v en :en terminal voltage, current capability should not exceed pd.
datasheet d a t a s h e e t 5/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (reference data) figure 4. efficiency (vin=12v, l=3.3/4.7/4.7h(vout=1.2/3.3/5.0v), cout=44f) figure 5. t c -i load (vin=12v, vout=3.3v, l=4.7h, cout=44f) 20 30 40 50 60 0.0 0.5 1.0 1.5 2.0 2.5 3.0 i load [a] tc[ ] vin=12v l=4.7h cout=44f t - time - 1sec/div vout(ac) [20mv/div] sw [5v/div] t - time - 1sec/div figure 7. vout ripple (vin=12v, vout=3.3v, l=4.7h, cout=44f, iout=3a) figure 6. vout ripple (vin=12v, vout=3.3v, l=4.7h, cout=44f, iout=0a) vout(ac) [20mv/div] sw [5v/div] 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 i load [a] efficiency [%] vout = 5.0v vout = 3.3v vout = 1.2v
datasheet d a t a s h e e t 6/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (reference data) (continued) 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 i lo ad [a] vout [v] figure 8. load regulation (vin=12v, vout=3.3v, l=4.7h, cout=44f) figure 9. line regulation (vout=3.3v, l=4.7h, cout=44f, iout=0a) figure 11. vout-temperature (vin=12v, vout=3.3v, l=4.7h, cout=44f, iout=0a) 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 4 6 8 1012141618 vin [v] vout [v] 490 510 530 550 570 590 610 4 6 8 10 12 14 16 18 vin [v] frequency [khz] 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 -40 -20 0 20 40 60 80 100 ta [ ] vout [v] figure 10. frequency (vout=3.3v, l=4.7h, cout=44f, iout=0a)
datasheet d a t a s h e e t 7/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (reference data) (continued) figure 13. off wave form (vin=12v, vout=3.3v, l=4.7h, cout=44f, iout=0a) figure 12. start up wave form (vin=12v, vout=3.3v, l=4.7h, cout=44f, iout=0a) en [ 5v/div ] vout [ 2v/div ] sw [10v/div] t - time ? 1msec/div figure 15. ocp function (vin=12v, vout=3.3v, l=4.7h, cout=44f, vout is short to gnd) figure 14. transient response (vin=12v, vout=3.3v, l=4.7h, cout=44f, iout=2a) t - time ? 200msec/div en [ 5v/div ] vout [ 2v / div ] sw [10v/div] t - time - 100sec/div vout(ac) [50mv/div] iout [2a/div] =+90mv =-87mv t - time - 200sec/div vout [5v/div] sw [20v/div] il [5a/div]
datasheet d a t a s h e e t 8/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 functional descriptions 1 enable control the device can be controlled on/off by en terminal voltage. an internal circuit starts when ven reaches 2.0v. when standing up of vin is too steep (1msec or less), a defect ive start might be caused according to the state of pascon between gnd substrate pattern and power supply-when the termina l en is short-circuited to the terminal vin and it is used. v en 0 v o 0 t ss v enh v enl en terminal output setting voltage figure 16. on/off transition wave form in en controlling
datasheet d a t a s h e e t 9/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 2 protection function protection circuit is effective for destruction prevention due to accident so that avoid using under continuous protection operation. 2-1 short circuit protection function (scp) the fb terminal voltage is compared with internal reference voltage vref. if fb terminal voltage falls below v scp (= vref - 240mv) and the state continues , output changes to low voltage and the state is fixed. during soft start, the fb terminal voltage is compared with internal soft start slope table 1. output short circuit protection function en terminal fb terminal short circuit protection function short circuit protection operation >v enh v scp effective on v scp off datasheet d a t a s h e e t 10/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 2-2 over voltage protection function (ovp) output over voltage protection is activa ted when fb voltage rises to or above v ovp (= vref + 240mv) and the state continues, output changes to low vo ltage and the state is fixed. table 2. output over voltage protection function en terminal fb terminal short circuit protection function short circuit protection operation >v enh v ovp effective on v ovp off datasheet d a t a s h e e t 11/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 2-3 under voltage lock out protection (uvlo) under voltage lock out protection mo nitors the vin terminal voltage. when the vin terminal voltage is lower than 3.8v (typ ), the device state changes to the standby mode. when the vin terminal voltage is higher than 4.1v (typ), the device starts operation. vin 0 vo hg lg fb soft start hys uvlo release uvlo detection normal operation normal operation uvlo hg : hi side fet gate signal lg : low side fet gate signal figure 19. uvlo timing chart 2-4 thermal shut down function bd86123a monitors the temperature of it self. when the temperature of the chip exceeds tj=175, the dc/dc converter is fixed in a low voltage. tsd function is aimed to shut down ic from thermal re ckless driving under an abnormal state to exceed tjmax=150. it aims at neither protection nor the guar antee of the set. therefore, please do not use this function to protect the set. vin en vout tj hg lg scp threshold scp delay time typ:1msec soft start detect (=175? ) release( =150? ) tsd release tsd normal operation normal operation tsd scp (off latch) normal operation tsd release hg : hi side fet gate signal lg : low side fet gate signal figure 20. tsd timing chart
datasheet d a t a s h e e t 12/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 2-5 over current protection function the over current protection function has been achieved by limiting the current that flows on high side mosfet. output current is limited by cycle-by-cycle. when an abnorma l state continues, the output is fixed in a low level. 2-6 error detection (off latch) release method bd86123a enters the state of off latch when the protection function operates. to release the off latch state, the vin terminal voltage shou ld be changed to less than uvlo level (=3.8v [typ] ) or, the en terminal voltage falls below v enl .voltage.
datasheet d a t a s h e e t 13/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 application example(s) 1 2 3 4 8 7 6 5 pgnd vin en agnd sw sw comp fb vout (3.3v) BD86123AEFJ l 4.7 h vin (12v) r_up 7.5k r_dw 2.4k cin 10.1 f cout 44 f ccomp 1500pf rcomp 33k c_up 33pf figure 21. application circuit however, the best values of application components are different between applications. please confirm actual application and decide values finally. maker part no input capacitor(cin) 10f/25v + 0.1f/50v tdk c3225jb1e106k + c1608jb1h104k output capacitor(cout) 22f/16v 2 tdk c3216jb1c226m 2 inductor (l) 4.7h tdk spm6530-4r7 fb vo(v) r_up [k ] r_dw [k ] 5 4.3 0.82 3.3 7.5 2.4 1.8 15 12 1.5 16 18 1.2 10 20 1 5.1 20
datasheet d a t a s h e e t 14/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 how to select parts of application (1) output lc filter constant selection the output lc filter is required to suppl y constant current to the output load. a larger value inductance at this filter results in less inductor ripple current( ? i l ) and less output ripple voltage. however, the larger value inductors tend to have less fast load transient -response, a larger physical size , a lower saturation current and higher series resistance. a smaller value induc tance has almost opposite characteristics above. so choosing the inductor ripple current( ? i l ) between 20 to 40% of the averaged inductor current (equivalent to the output load current) is a good compromise. figure 22. figure 23. setting ? i l = 30% x averaged inductor current (3a) = 0.9 [a] l = v out ? (v in - v out ) ? 1 = 4.83 [h] P 4.7 [h] v in ? ? ? i l where v in = 12v, v out = 3.3v, f osc = 550 khz, ; f osc is a switching frequency also the inductor should have the higher saturation current than i outmax + ? i l / 2. the output capacitor c out affects the output ripple-voltage. choose the large capacitor to achieve the small ripple-voltage enough to meet the application requirement. output ripple voltage ? v rpl is calculated by the following equation. where r esr is a parasitic series resistance in output capacitor. setting c out = 44f, r esr = 10m ? v rpl = 0.9 ? (10m + 1 / (8 ? 44 ? 550k)) = 13.6mv (2) design of feedback resistance constant set the feedback resistance as shown below. figure 24. ? v rpl = ? i l ? ( r esr + 1 ) [v] 8 ? c out ? ? 0.8 [v] r2 i l t i outmax + ? v out r1 r2 err 0.8v fb
datasheet d a t a s h e e t 15/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 (3)loop compensation choosing compensation capacitor c cmp and resistor r cmp the current-mode buck converter has 2-poles and 1-zero system . choosing the compensation resistor and capacitor is important for a good load-transient response and good stability. the example of dc/dc converter application bode plot is shown below. the compensation resistor r cmp will decides the cross over frequency f crs (the frequency that the total dc-dc loop-gain falls to 0db). setting the higher cross over frequency achieves good res ponse speed, however less stability. while setting the lower cross over frequency shows good stability but worse response speed. the 1/10 of switching frequency for the cross over fr equency shows a good performance at most applications. ( i ) choosing phase compensation resistor r cmp the compensation resistor r cmp can be on following formula. where v out ; output voltage, f crs ; cross over frequency, c out ; output capacitor, v fb ; internal feedback voltage ( 0.8v (typ) ), g mp ; current sense gain ( 4.3a/v (typ) ) , g ma ; error amplifier trans-conductance ( 400a/v (typ) ) setting v out = 3.3v, f crs = 55khz, c out = 44f ( ii ) choosing phase compensation capacitor c cmp for the stability of dc/dc converter, canceling the phase delay that derives from output capacitor c out and resistive load r out by inserting the phase advance. the phase advance can be added by the zero on compensation resistor r cmp and capacitor c cmp . making fz= f crs / 6 gives a first-order estimate of c cmp . however, the best values of zero and f crs are different between applications. after calculation above formula and confirmation actual application, please decide values finally. ( iii ) the condition of the loop compensation stability the stability of dc/dc converter is import ant. to secure the operating stability, please check the loop compensation has the enough phase-margin. for the condition of loop compen sation stability, the phase-delay must be less than 150 degree where gain is 0 db. feed forward capacitor c rup boosts phase margin over a limited frequency range and is sometimes used to improve loop response. c rup will be more effective if r up >> r up ||r dw figure 25. figure 26. r cmp = 2 ? v out ? ? ] v fb ? ? ? 3.3 ? 55k ? 44 = 37.3k P 33k [ ] 0.8 ? ? 400 compensation capacitor c cmp = vout cout [f] iout ? 44 = 1.47n P 1.5n [f] 3 33k v out r up c cmp comp r cmp fb r dw 0.8v c rup phase margin 180 90 180 90 0 0 a (a) gbw(b) f f gain [db] phase f crs
datasheet d a t a s h e e t 16/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuit (s) 5.fb 7,8.sw 3.en 6.comp figure 27. 250 725 2 2 0.5 0.5 20 10 10
datasheet d a t a s h e e t 17/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 notes for use 1) absolute maximum ratings use of the ic in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in ic damage. assumptions should not be made re garding the state of the ic (short mode or open mode) when such damage is suffered. a physical safety measure such as a fuse should be implemented when use of the ic in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) gnd potential ensure a minimum gnd pin potential in all operating conditions. 3) setting of heat use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4) pin short and mistake fitting use caution when orienting and positioning the ic for mounti ng on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or betwee n output pins and the power supply and gnd pins caused by the presence of a foreign object may result in damage to the ic. 5) actions in strong magnetic field use caution when using the ic in the pres ence of a strong magnetic field as doi ng so may cause the ic to malfunction. 6) testing on application boards when testing the ic on an application board, connecting a capacito r to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. ground the ic during assembly steps as an antistatic measure, and use similar caution when transporting or storing the ic. always turn the ic's power supply off before connecting it to or removing it from a jig or fi xture during the inspection process. 7) ground wiring patterns when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring patterns of any external components. 8) regarding input pin of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent el ements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, when the resistors and transistors are connected to the pins as shown in figure 26. , a parasitic diode or a transistor operates by invertin g the pin voltage and gnd voltage. the formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable resul t of the ic's architecture. the operation of parasitic elements can cause interference with circuit operation as well as ic malfunction and damage. for these reasons, it is necessary to use caution so that the ic is not used in a way that will trigger the operation of parasitic elements such as by th e application of voltages lower than the gnd (p substrate) voltage to input and output pins. figure 28. example of a simple monolithic ic architecture (pin a) gnd n p n n p+ p+ resistor parasitic elements p parasitic elements ( pin b ) gnd c b e parasitic elements gnd ( pin a ) gnd n p n n p+ p+ parasitic elements p substrate ( pin b ) c b e transistor (npn) n gnd
datasheet d a t a s h e e t 18/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 9) overcurrent protection circuits an overcurrent protection circuit designed according to the out put current is incorporated fo r the prevention of ic damage that may result in the event of load shor ting. this protection circuit is effect ive in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. at the time of thermal designing, keep in mind that the current capacity has negative characteristics to temperatures. 10) thermal shutdown circuit (tsd) this ic incorporates a built-in tsd circuit for the protecti on from thermal destruction. the ic should be used within the specified power dissipation range. however, in the event that the ic continues to be operated in excess of its power dissipation limits, the attendant rise in the chip's junction te mperature tj will trigger the tsd circuit to turn off all outpu t power elements. operation of the tsd circuit presumes that the ic's absolute maximum ratings have been exceeded. applicat ion designs should never make use of the tsd circuit. 11) en control speed chattering happens if standing lowering speed is slow when standing of en pin is lowered. the reverse current in which the input side and the pressure operation are done fr om the output side is generated when chattering operates with the output voltage re mained, and there is a case to destruction. please set to stand within 100s when you control on/off by the en signal. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority
datasheet d a t a s h e e t 19/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 power dissipation ordering information b d 8 6 1 2 3 a e f j - e 2 part numbe r package efj: htsop-j8 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram(s)(top view) htsop-j8(top view) 86123a part number marking lot number 1pin mark (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.85 0.05 1.27 0.08 0.08 0.42 +0.05 - 0.04 1.05 0.2 0.65 0.15 4 + 6 ? 4 0.17 +0.05 - 0.03 234 5 6 8 (max 5.25 include burr) 7 1 0.545 (3.2) 4.9 0.1 6.0 0.2 (2.4) 3.9 0.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin htsop-j8 package on 70 ? 70 ? 1.6 mm glass epoxy pcb (1) 1-layer board (backside copper foil area 0 mm ? 0 mm) (2) 2-layer board (backside copper foil area 15 mm ? 15 mm) (3) 2-layer board (backside copper foil area 70 mm ? 70 mm) (4) 4-layer board (backside copper foil area 70 mm ? 70 mm)
datasheet d a t a s h e e t 20/20 BD86123AEFJ tsz02201-0j2j0d100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 history date revision changes 04.sep.2012 001 new release

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